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    국내학술지 제목 게시판 내용
    제목(국문) 5층 링 조명에 의한 BGA 볼의 검사 방법
    제목(영문) Inspection method of BGA Ball Using 5 ... step Ring Illumination
    저자 김종형 (Jong-Hyeong Kim ,Department of Mechanical System Design, Seoul National University of Science and Technology ) ▷공저자네트워크등록하기
    - (ChanhD. Tr. Nguyen ,Division of Mechanical Engineering, KAIST ) ▷공저자네트워크등록하기
    초록
    초록(영문)

    Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as "iso-slope contours". Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method

    keyword BGA balls, Specular reflection, 5-step ring illumination, iso-slope contour, hybrid reflectance model
    저널명 제어로봇시스템학회논문지 ▷관련저널보기
    VOL 21
    PAGE 1115
    발표년도 2015
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