국내 최대 기계 및 로봇 연구정보

기술보고서

기술보고서 게시판 내용
타이틀	Evaluation Methodology Guidance for Stack Packages
저자	Ghaffarian, Reza;; Gerke, David
Keyword	ELECTRONIC PACKAGING;; MICROELECTRONICS;; MANUFACTURING;; RELIABILITY ANALYSIS;; POLYIMIDES;; COMMERCIAL OFF-THE-SHELF PRODUCTS;; HIGH FREQUENCIES;; TECHNOLOGY UTILIZATION;; THIN FILMS;; THREE DIMENSIONAL MODELS;; TEMPERATURE PROFILES;;
URL	http://hdl.handle.net/2060/20100040618
보고서번호	JPL-Publ-09-23
발행년도	2009
출처	NTRS (NASA Technical Report Server)
ABSTRACT	This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology. Perform a literature survey on the evaluation methodology for 3D package and assembly. Combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly. Generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly. Provide recommendations on future experimental activities.